In Project 1, research is in close collaboration with an industrial partner in the solid state lighting industry, to develop a low-cost assembly process of LED chips on large scale substrates. Project 2 involves research in the field of integration of semiconductor chips on stretchable substrates. Specific applications are “electronic tattoos” where electronic chips form a conformal electrically connected array on stretchable tissues and/or human skin to record biomedical data.The positions are initially for three years. Compensation is based on the provisions of the collective agreements in the public sector (Thüringen, TV-L, TVÜ) and based on the applicant’s experience up to pay scale E 13. The successful candidate will be responsible for research in the field of assembly of miniaturized electronic components made of silicon and III / V semiconductors whereby the physical principle of assembly is based on novel surface tension-based self-assembly principles and transfer techniques. The tasks involve: • Independent scientific research in the emerging fields of (1) Self-organized assembly of semiconductor devices or (2) transfer-based assembly of semiconductor devices. • Planning, implementation, and evaluation of experimental work. • The design and implementation of the necessary physical setups to establish working principles and machine designs for industrial use.